3.11.2023 | 09:49
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3.11.2023 | 09:49

 
 
 

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Reimagining smartphones

Modular mobile devices for less electronic waste

Smartphones are indispensable in modern life, but their production and usage harm the environment. Engineers at Fraunhofer IZM aimed to reconcile technology and a circular economy. They unveiled two attractive designs for durable, recyclable smartphones, addressing this eco-challenge.

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ANZEIGE
 

 
 
     
 
 
     
 
 
 
GKN Automotive presents eCrate

New concept for plug-and-play electric drive unit

 
 

 

GKN Automotive is introducing a plug-and-play eDrive concept. With the new drive unit, the company is meeting the growing demand from niche suppliers and converters who want to equip their vehicles with an electric drive.

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Part of Siemens Xcelerator

Industrial Edge reaches a new level

 
 

 

At the SPS trade fair, Siemens is expanding its range of products and services for Industrial Edge at all levels: from a cloud-based management system as-a-service to new hardware and software to low-code programming of edge apps with "Mendix on Edge".

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Kioxia and Western Digital

No Merger after all

 
 

 

The merger agreement was supposed to be ready for signing by the end of October. Because SK Hynix rejected the merger, Western Digital is now withdrawing from the negotiations.

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GlobalWafers

8-Inch SiC Wafers from 2024

 
 

 

GlobalWafers has developed its own technology for the production of SiC wafers with a diameter of 8 inches and plans to start production from the fourth quarter of 2024.

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Socionext

SoCs for Advanced ADAS and AD Using 3nm Automotive Process

 
 

 

Socionext, today announced it is developing custom SoCs for advanced ADAS (Advanced Driver Assistance Systems) and AD (Autonomous Driving) using N3A, TSMC's latest 3nm automotive process technology. Target production of the SoCs will be in 2026.

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Strategic Partners in process automation

Sick and Endress+Hauser plan to join forces

 
 

 

German sensor company Sick and Swiss measurement and automation technology specialist Endress+Hauser want to intensify their cooperation. Both companies are aiming for a strategic partnership for Sick's process automation business segment and have signed a joint memorandum of understanding.

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TRAVEO T2G Cluster graphics MCU family

MPU like performance at MCU cost for automotive applications

 
 

 

Infineon Technologies announced its new TRAVEO T2G Cluster family of automotive microcontrollers (MCU) with a new graphic engine. The engine features a new smart rendering technology and delivers outstanding performance for automotive graphics applications.

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Europlacer

New Premium Stencil Printer Platform

 
 

 

Europlacer (Hall A3, Booth 215) announces the launch at productronica of a brand-new screen printer that introduces a range of productivity enhancements that include a maintenance-free printhead offering active closed-loop squeegee pressure and zero squeegee calibration.

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For easy OEM integration

Lasers for Multi-wavelength Digital Holography

 
 

 

Toptica introduces new wavelengths at 445 nm and 447 nm in its TopMode single-frequency diode laser series, pushing the boundaries of high-resolution Raman spectroscopy, microlithography, multi-wavelength digital holography and interferometry.

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STMicroelectronics

Revenues increased slightly in the third quarter

 
 

 

ST reported third quarter net revenues of .43 billion, gross margin of 47.6%, operating margin of 28.0%, and net income of .09 billion or .16 diluted earnings per share.

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Testing High-End Automotive SoCs

Active Thermal Control for Advantest Handler

 
 

 

The new Active Thermal Control (ATC) option for Advantests M4841 high-volume device handler provides dynamic regulation of temperature fluctuations caused by automotive semiconductors self-heating during test, ensuring more accurate production test of up to 16 SoCs in parallel.

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