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ScienceDaily: Matter & Energy News |
| Novel heat-management material keeps computers running cool Posted: 29 Jun 2021 04:17 PM PDT UCLA engineers have demonstrated successful integration of a novel semiconductor material into high-power computer chips to reduce heat on processors and improve their performance. The advance greatly increases energy efficiency in computers and enables heat removal beyond the best thermal-management devices currently available. |
| Molecular 'speed bump' adds function to new generation of printed objects Posted: 29 Jun 2021 11:43 AM PDT A process that uses heat to change the arrangement of molecular rings on a chemical chain creates 3D-printable gels with a variety of functional properties. |
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