Inspiring the Evolution of Embedded Design

May 7, 2024


Smarter, Sleeker, Stronger

POWERBOX Announces ECD1000A – 1000W IP65 for Defense

Housed in a metal IP65 enclosure with baseplate conduction cooling, the ECD1000A series delivers 1000W and can be used with a baseplate operating temperature range of -40 up to +75 degrees C. For extremely demanding applications the ECD1000A is mechanically ruggedized according to the MIL-STD-810H standard and interior boards and components are protected with a conformal coating. 


The power supply operates with a wide universal input range from 85 to 305VAC with power factor correction (PFC). Designed for high availability, short time-to-market and to meet commercial and military off-the-shelf (COTS/MOTS) business models, the ECD1000A is available in a 28VDC output voltage version, however the series also includes 500W and 700W versions with 12VDC and 28VDC output voltages for use in lower power distribution systems.

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HMI Introduces a Single-Channel 80 mΩ High-Side Switch Ideal for Automotive Applications

The HL8518 is a single-channel, high-side power switch with 80 mΩ (typical) Rds(on) power FET. It combines comprehensive diagnostic capabilities, full protection mechanisms, and a high-precision current detection function. Through intelligent control of the load, it also enhances system safety.


The HL8518 utilizes an internal power FET with adjustable current limits through an external resistor connection, and an internal charge pump facilitates efficient gate control. The device actively regulates output current, and connecting the ILIM pin to the ground establishes a default current limit. 

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Vishay Intertechnology 600 V E Series Power MOSFET Delivers Industry’s Lowest RDS(ON)*Qg FOM

Measuring 10.42 mm by 8 mm by 1.65 mm, the SiHR080N60E’s compact PowerPAK 8 x 8LR package features a 50.8 % smaller footprint than the D²PAK while offering a 66 % lower height. Due to its top-side cooling, the package delivers excellent thermal capability, with an extremely low junction to case (drain) thermal resistance of 0.25 °C/W. This allows for 46 % higher current than the D²PAK at the same on-resistance level, enabling dramatically higher power density. In addition, the package’s gullwing leads provide excellent temperature cycle capability.

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Editor's Desk by Kirsten Campbell



From Clunky to Cutting Edge

Gone are the days of clunky, inefficient analog circuits and power systems that barely kept up with the demands of modern electronics. Thanks to advancements in semiconductor technology and innovative engineering, analog components are now more precise, reliable, and versatile than ever before.


From high-resolution analog-to-digital converters to ultra-low-noise amplifiers, these components enable embedded systems to sense, measure, and interact with the world around them with unprecedented accuracy and efficiency.


But it's not just about precision – power management has also come a long way.

With the rise of energy-efficient designs and intelligent power management algorithms, embedded boards can now achieve remarkable levels of performance while minimizing power consumption.


The integration of analog and power capabilities directly onto the same silicon die as digital components has streamlined the design process and reduced board footprint, enabling smaller, lighter, and more power-efficient embedded systems. Behind every digital powerhouse lies a sophisticated analog and power infrastructure, quietly but confidently supporting its every function.


As technology continues to evolve, I can only imagine the boundless possibilities that lie ahead for analog and power in the embedded space.


What would you like to see, more editorial or less, more of a particular topic, or less? Let us know. Reach out to the Product Editor

Latest News

MYC-LMX9X: MYIR’s Low-Cost SoM with Integrated NPU for Industrial IoT

MYIR has unveiled the MYC-LMX9X, a new embedded System on Module powered by the NXP i.MX 9352 processor. This SoM, designed specifically for industrial applications, leverages a high-performance i.MX 93 series processor, which includes dual ARM Cortex-A55 cores clocked up to 1.7GHz and an ARM Cortex-M33 core running at 250MHz.

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