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4-Channel Temp Measurement HAT Can be Stacked Eight High per Pi
Measurement Computing Corp. (MCC) has launched its third DAQ HAT for the Raspberry Pi, this time taking on temperature measurement. The $149 MCC 134 Thermocouple Measurement HAT follows its MCC 118 voltage measurement DAQ HAT with eight ±10 V inputs and sample rates up to 100 ksamples/s and its MCC 152 voltage output and digital I/O HAT with dual 0-5 V analog outputs at up to 5 ksamples/s and 8x configurable DIO. The MCC 134 lets you connect four differential thermocouples to the electrically isolated input channels to take temperature measurements. It supports thermocouple types J, K, R, S, T, N, E and B, which are software selectable per channel, with the values updated at a minimum of one-second intervals.
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Whiskey Lake-UE Boards Featureup to 15-year Availability
Congatec has launched a "Conga-TC370" COM Express Type 6 and two SBCs--the 3.5-inch "Conga-JC370" and thin Mini-ITX "Conga-IC370"---with new embedded "UE" 8th Gen chips with 10-year plus availability. At Embedded World in early March, Congatec unveiled 3.5-inch Conga-JC370 and thin Mini-ITX Conga-IC370 SBCs with Intel's 8th Gen Whiskey Lake U-series processors. Now, the German embedded firm has announced their availability along with a new Conga-TC370 COM Express Compact Type 6 module. The Linux-friendly boards sport Intel's new embedded-focused UE versions of the chips, featuring 10-year plus availability.
This is the first we've heard of the Whiskey Lake UE models, which do not appear to be publicly documented. The processors appear to be otherwise identical with the 8th Gen U-series. Congatec claims its new boards "are the first in the industry to offer long-term availability of 10+ years." The boards offer "10+ and on basis of specific last time buy contract up to 15 years long-term availability right from the start," stated Christian Eder, Congatec Director of Marketing.
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3.5-Inch SBC Serves up Coffee Lake-H Processors
COMMELL has unveiled its LE-37M 3.5-inch SBC based on Intel 8th generation Coffee Lake-H Core processor family. The Coffee Lake-H 8th generation Intel Core i7/i5/i3 processors provides higher computing and graphics performance but at a similar power dissipation level to the previous 7th generation. The LE-37M SBC will be offered with two processor variants: LE-37M5 comprised of Core i5-8400H Max Turbo up to 4.2 GHz with 4 CPU cores, 8-thread and 45 W TDP; and the LE-37M7 comprised of Core i7-8850H Max Turbo up to 4.3 GHz with 6 CPU cores, 12-thread and 45 W TDP.
The LE-37M 3.5-inch SBC is designed for the 8th generation Intel Core H-series processors in the FCBGA1440 and accompany with Intel QM370 chipset. DDR4 memory is supported up to a total of 32 GB (DDR4 SO-DIMM 2,666 MHz). The SBC is based on powerful Intel UHD Graphics that provides high-end media and graphics capabilities, allows triple independent display with 4k resolution each and comes with hardware-based video encoding and decoding up to 4k.
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Tiny Snapdragon 820E Module Boasts Long Lifecycle Support
Intrinsyc's $259 "Open-Q 820Pro μSOM" module runs Android 9 or Debian Linux on a quad-core, up to 2.34 GHz Snapdragon 820E and offers long lifecycles, 4 GB LPDDR4, 32 GB flash, Wi-Fi-ac and an optional $499 dev kit.The Open-Q 820Pro μSOM is a pin-compatible drop-in replacement for the two- year old Open-Q 820 µSOM and offers a similar layout and 50 mm x 25 mm footprint.
The biggest difference is an upgrade from Qualcomm's Snapdragon 820 to the faster, second-gen Snapdragon 820E, an embedded-focused version with long lifecycle support. As a result, the Open-Q 820Pro μSOM has a 9 percent faster CPU and 5 percent faster GPU at the same power consumption, claims Intrinsyc. The Snapdragon 820E clocks two of its Cortex-A72-like Qualcomm Kryo cores to 2.342 GHz, up from 2.0 GHz, and the other two at the same 1.593 GHz rate. The SoC's Adreno 530 GPU has bumped up to 652.8 MHz and the Hexagon 680 DSP is clocked at 825 MHz.
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PCB Assembly - $1000 in FREE Labor
SlingShot is Offering Free Labor for 1st Time Customers! They are changing the game in PCB assembly. Doing the impossible, everyday. For a limited time, SlingShot Assembly is offering FREE LABOR, up to $1,000, on new customers' first turn-key order. Their 5-day turn includes parts, boards AND assembly. SlingShot Assembly challenges you to try something different.
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Updated COMe Board Sports 9th Gen Intel Processors, 128 GB RAM
Kontron is providing its COMe-bCL6 COM Express basic Type 6 form factor (125 mm x 95 mm) board now equipped with Intel 9th Gen processors. With up to four memory sockets it enables a maximum memory expansion of up to 128 GB. The board is available in different processor versions. All versions can be equipped with up to 128 GB non-ECC/ECC DDR4 memory.
The Intel Optane system accelerator ensures fast data transfer from and to high-capacity mass storage devices. NVMe SSD also supports what is currently the fastest storage technology in a very compact package. Thanks to USB 3.1 support with up to 10 Gbps and USB Type-C support, twice the bandwidth (compared to USB 3.0) can be achieved for fast data transfers.
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Industry News & Recent Posts
Espressif Systems has announced the release of the ESP32-S2 Secure Wi-Fi MCU, a highly integrated, low-power, 2.4 GHz Wi-Fi SoC supporting Wi-Fi HT40 and 43 GPIOs. Based on the Xtensa single-core 32-bit LX7 processor, ESP32-S2 can be clocked at up to 240 MHz. ... Continue reading →...»
Microchip Technology, via its Microsemi subsidiary, has announced the production release of a family of Silicon Carbide (SiC) power devices that leverage the ruggedness and the performance benefits of wide-bandgap technology. Complemented by Microchip's broad range of MCUs and analog solutions, the SiC devices join the company's family of SiC products designed to meet the needs of Electric Vehicles (EVs) and other high-power applications in fast-growing markets. ... Continue reading →...»
STMicroelectronics has announced new STM32H7 MCUs which it claims are the industry's highest-performing Arm Cortex-M general-purpose MCUs, combining dual-core performance with power-saving features and enhanced cyber protection. The new devices leverage a 480 MHz version of the Cortex-M7, the highest performing member of Arm's Cortex-M family, and add a 240 MHz Cortex-M4 core. ... Continue reading →...»
Texas Instruments (TI) has introduced a new ultra-high-speed ADC with what it claims is the industry's widest bandwidth, fastest sampling rate and lowest power consumption. The ADC12DJ5200RF helps engineers achieve high measurement accuracy for 5G testing applications and oscilloscopes, and direct X-band sampling for radar applications, says TI. ... Continue reading →...»
There's much be to learned about how electronics can interact with biological signals-not only to record, but also to see how they can be used as inputs for control applications. With ongoing research in fields such as virtual reality and prosthetics, new systems are being developed to interpret different types of signals for practical applications. ... Continue reading →...» |
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